| Manufacturer |
Arctic Silver
|
| Model |
5 High-Density Polysynthetic Silver
|
| Part # |
AS5-3.5G
|
| Amount |
3.5g
|
| Features |
- Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
- Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability
- Ensure the best physical contact between the heatsink and the CPU core.
- Will not separate, run, migrate, or bleed.
- 3.5-gram
|
| Specifications |
- Average Particle Size: <0.49 micron <0.000020 inch
- Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C
- Long-Term: -50 Degrees C to 130 Degrees C
- Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
- Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
|