Specifications
Manufacturer
Arctic Silver
Model
5 High-Density Polysynthetic Silver
Part #
- AS5-3.5G
- AS-AS5-35
Amount
3.5 g
Features
- Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
- Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability
- Ensure the best physical contact between the heatsink and the CPU core.
- Will not separate, run, migrate, or bleed.
- 3.5-gram
- Average Particle Size: <0.49 micron <0.000020 inch
- Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C
- Long-Term: -50 Degrees C to 130 Degrees C
- Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
- Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Prices
| Merchant | Base | Promo | Shipping | Tax | Availability | Total | |
|---|---|---|---|---|---|---|---|
|
$6.13 | In stock | $6.13+ | Buy | |||
| ( 14 new from $6.13. Last updated 11 minutes ago. ) | |||||||
|
$7.95 | In stock | $7.95+ | Buy | |||
* Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon.com at the time of purchase will apply to the purchase of this product.
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Price Alert
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Specifications
Manufacturer
Arctic Silver
Model
5 High-Density Polysynthetic Silver
Part #
- AS5-3.5G
- AS-AS5-35
Amount
3.5 g
Features
- Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
- Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability
- Ensure the best physical contact between the heatsink and the CPU core.
- Will not separate, run, migrate, or bleed.
- 3.5-gram
- Average Particle Size: <0.49 micron <0.000020 inch
- Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C
- Long-Term: -50 Degrees C to 130 Degrees C
- Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
- Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Price History
* Amazon pricing is not included in price history graphs.
- 4 points
- 13 days ago
from completed build My first gaming pc
Very thick when putting cpu cooler on I felt how dense the paste was
- 4 points
- 29 days ago
from completed build BlackBox4: The Legend Continues
Does what I tell it to do, which includes but is not limited to: 1. Coming out of a tube. 2. Cooling my CPU.
- 9 points
- 1 month ago
from completed build First build (summer 24)
Its thermal paste. It does the job better than I assume the cheap looking one included with my AIO would do. 5 stars.
- 5 points
- 3 months ago
from completed build Touch This Grass
Enough thermal paste, works pretty well, cannot complain..
- 5 points
- 3 months ago
from completed build Gf $250 Scavanger PC
stuffs good. idk i dont test thermal paste.
- 19 points
- 4 months ago
from completed build 2024 Glow Up
Does exactly what it should and does it very well. Easy to apply.
- 7 points
- 5 months ago
from completed build For My Sleepless Nights/A 15 YRs PC
It's thermal paste. Better than what came on my AIO.
- 2 points
- 5 months ago
from completed build Upgraded first build
Its thermal paste, works fine on my cpu and gpu.
- 1 point
- 5 months ago
from completed build Graduation Refresh
It is, in fact, thermal compound. Never had a heat transfer issue so...
